1 rectifier device data
?
? ! d 2 pak surface mount power package the d 2 pak power rectifier employs the schottky barrier principle in a large metaltosilicon power diode. stateoftheart geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. these stateoftheart devices have the following features: ? guardring for stress protection ? low forward voltage ? 100 c operating junction temperature ? epoxy meets ul94, vo at 1/8 ? guaranteed reverse avalanche ? short heat sink tab manufactured e not sheared! ? similar in size to the industry standard to220 package mechanical characteristics ? case: epoxy, molded ? weight: 1.7 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? shipped 50 units per plastic tube ? available in 24 mm tape and reel, 800 units per 13 reel by adding a at4o suffix to the part number ? marking: b2515l maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 15 volts average rectified forward current (rated v r ) t c = 90 c i f(av) 25 amps peak repetitive forward current (rated v r , square wave, 20 khz) t c = 100 c i frm 30 amps nonrepetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 amps storage temperature t stg 65 to +150 c operating junction temperature t j 100 c voltage rate of change (rated v r ) dv/dt 10000 v/ m s thermal characteristics thermal resistance e junction to case e junction to ambient (1) r q jc r q ja 1.0 50 c/w (1) when mounted using minimum recommended pad size on fr4 board. designer's data for aworst caseo conditions e the designer's data sheet permits the design of most circuits entirely from the information presented. soa limit curves e representing boundaries on device characteristics e are given to facilitate aworst caseo design. designer's and switchmode are trademarks of motorola, inc. thermal clad is a trademark of the bergquist company preferred devices are motorola recommended choices for future use and best overall value. order this document by MBRB2515L/d semiconductor technical data ? motorola, inc. 1996 1 3 4 schottky barrier rectifier 25 amperes 15 volts case 418b02 d 2 pak 4 3 1 motorola preferred device rev 1
2 rectifier device data electrical characteristics rating symbol value unit maximum instantaneous forward voltage (2) (i f = 19 amps, t j = 70 c) (i f = 25 amps, t j = 70 c) (i f = 25 amps, t j = 25 c) v f 0.28 0.42 0.45 volts maximum instantaneous reverse current (2) (rated dc voltage, t j = 70 c) (rated dc voltage, t j = 25 c) i r 200 15 ma (2) pulse test: pulse width = 300 m s, duty cycle 2.0% figure 1. typical forward voltage figure 2. typical reverse leakage current figure 3. typical forward power dissipation figure 4. current derating, case 0.3 0 v f , instantaneous voltage (volts) 50 7.0 2.0 5.0 1.0 v r , reverse voltage (volts) 0 0.2 0.02 0 i f(av) , average forward current (amps) 25 10 5.0 0 t c , case temperature ( c) 65 60 40 30 20 10 0 70 i f , instantaneous forward current (amps) i p i f(av) , average forward current (amps) 0.7 0.5 0.3 0.1 0.2 0.4 4.0 8.0 12 16 0.1 1.0 10 20 30 40 75 80 100 0.2 0.1 0.5 20 , reverse leakage current (ma) r 2.0 10 20 100 200 , average forward power dissipation (watts) f(av) square wave dc square wave dc t j = 25 c 70 c t j = 100 c 3.0 0.01 25 c 20 15 30 40 35 35 25 15 5.0 85 90 95 70 c rated voltage applied r jc = 1 c/w 10 20 30 5.0 15 25 35 5.0 t j = 70 c i pk i av 10 2.0 6.0 10 14 18 1000 400 40 4.0 0.4 0.04
3 rectifier device data information for using the d 2 pak surface mount package minimum recommended footprints for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 0.70 17.78 0.0625 1.587 0.08 2.032 0.15 3.81 0.350 8.89 0.450 11.43 d 2 pak power dissipation the power dissipation of the d 2 pak is a function of the drain pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient; and the operating temperature, t a . using the values provided on the data sheet for the d 2 pak package, p d can be calculated as follows: p d = t j(max) t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 2.5 watts. p d = 150 c 25 c 50 c/w = 2.5 watts the 50 c/w for the d 2 pak package assumes the recommended drain pad area of 158k mil 2 on fr4 glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts using the footprint shown. another alternative is to use a ceramic substrate or an aluminum core board such as thermal clad ? . by using an aluminum core board material such as thermal clad, the power dissipation can be doubled using the same footprint. general soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 5 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * due to shadowing and the inability to set the wave height to incorporate other surface mount components, the d 2 pak is not recommended for wave soldering.
4 rectifier device data recommended profile for reflow soldering for any given circuit board, there will be a group of control settings that will give the desired heat pattern. the operator must set temperatures for several heating zones, and a figure for belt speed. taken together, these control settings make up a heating aprofileo for that particular circuit board. on machines controlled by a computer, the computer remembers these profiles from one operating session to the next. figure 5 shows a typical heating profile for use when soldering the d 2 pak to a printed circuit board. this profile will vary among soldering systems but it is a good starting point. factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. this profile shows temperature versus time. the line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. the two profiles are based on a high density and a low density board. the vitronics smd310 convection/in- frared reflow soldering system was used to generate this profile. the type of solder used was 62/36/2 tin lead silver with a melting point between 177 189 c. when this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. step 1 preheat zone 1 arampo step 2 vent asoako step 3 heating zones 2 & 5 arampo step 4 heating zones 3 & 6 asoako step 5 heating zones 4 & 7 aspikeo step 6 vent step 7 cooling 200 c 150 c 100 c 50 c time (3 to 7 minutes total) t max solder is liquid for 40 to 80 seconds (depending on mass of assembly) 205 to 219 c peak at solder joint desired curve for low mass assemblies desired curve for high mass assemblies 100 c 150 c 160 c 170 c 140 c figure 5. typical solder heating profile for d 2 pak
5 rectifier device data package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 case 418b02 issue b seating plane b s g d t m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a style 3: pin 1. anode 2. cathode 3. anode 4. cathode
6 rectifier device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. mfax is a trademark of motorola, inc. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : nippon motorola ltd.: spd, strategic planning office, 4321, p.o. box 5405, denver, colorado 80217. 3036752140 or 18004412447 nishigotanda, shinagawaku, tokyo 141, japan. 81354878488 mfax ? : rmfax0@email.sps.mot.com touchtone 6 022446609 asia / pacific : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, us & canada only 18007741848 51 ting kok road, tai po, n.t., hong kong. 85226629298 internet : http://motorola.com/sps MBRB2515L/d ? codeline to be placed here
|
